Customer-obsessed science
Research areas
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November 20, 20254 min readA new evaluation pipeline called FiSCo uncovers hidden biases and offers an assessment framework that evolves alongside language models.
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October 20, 20254 min read
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October 14, 20257 min read
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October 2, 20253 min read
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Featured news
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NeurIPS 2022 Workshop on Federated Learning: Recent Advances and New Challenges2022With an ever-increasing number of smart edge devices with computation and communication constraints, Federated Learning (FL) is a promising paradigm for learning from distributed devices and their data. Typical approaches to FL aim to learn a single model that simultaneously performs well for all clients. But such an approach may be ineffective when the clients’ data distributions are heterogeneous. In
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NABE 20222022We propose a novel architecture for time series models built upon state-space methods. We jointly estimate many, potentially multivariate, distributions defined using state-space models by partially pooling their parameters across the cross-section. These joint distributions define a novel recurrent neural network. By combining state-space methods and neural networks, we leverage the interpretability of
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Science2022Long-distance quantum communication and networking require quantum memory nodes with efficient optical interfaces and long memory times. We report the realization of an integrated two-qubit network node based on silicon-vacancy centers (SiVs) in diamond nanophotonic cavities. Our qubit register consists of the SiV electron spin acting as a communication qubit and the strongly coupled 29Si nuclear spin acting
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IEEE International Conference on Knowledge Graph (ICKG 2022)2022Graph Neural Networks (GNNs) require that all nodes have initial representations which are usually derived from the node features. When the node features are absent, GNNs can learn node embeddings with an embedding layer or use pretrained network embeddings for the initial node representations. However, these approaches are limited because i) they cannot be easily extended to initialize new nodes that are
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24th IEEE Electronics Packaging Technology Conference (EPTC2022)2022System-in-Package (SiP) technology provides a valuable opportunity to make products with smaller form factor, enrich functionality, and better reliability performance for consumer electronics. One key reason for SiP's success is the encapsulated structure using molding compound, which can provide protection to all the components inside and allows reduced component-to-component spacing. However, if the design
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